IEEE SC ImageIEEE SC Image
IEEE SC Image

Technical Committee on 
Flexible Printed Sensors and Systems (TC-FLEPS)

Established: 2024

Scope

Flexible and printed sensors and systems are creating new opportunities for lightweight, low-cost, and adaptable technologies. With applications spanning wearable health monitoring, soft robotics, smart packaging, structural health monitoring, environmental sensing, IoT devices, and others, flexible sensors and systems are rapidly gaining attention. Advances in novel materials, scalable fabrication and packaging, system integration, and reliability studies are driving this growth, enabling innovative solutions in the applications mentioned earlier.

Objective

The technical committee aims to foster collaboration and knowledge exchange among researchers from academia, industry, and government. Its goal is to identify and advance technologies and technical approaches that will drive progress in the field of flexible, wearable, and printed sensors and systems. These exchanges will take place through conferences, workshops, special sessions, and publications, all designed to promote discussion and innovation in technical and technological developments.

IEEE TC-FLEPS Chair and Vice-Chair

Ravinder Dahiya
Optical Sensors cluster leader
Chair, TC-FLEPS
Northeastern University, Boston, USA
IEEE SC Image
Luigi Ochhipinti
Optical Sensors cluster leader
Vice-Chair, TC-FLEPS
University of Cambridge, UK

IEEE TC-FLEPS Members

Matti Mantysallo
Leader
Tampere University, Finland
IEEE SC Image
Vincenzo Vinciguerra
Leader
ST Microelectronics, Italy
IEEE SC Image
Mitradip Bhattacharya
Leader
IISER Bhopal, India
IEEE SC Image
Kourosh Kalantar Zadeh
Leader
University of Sydney, Australia
IEEE SC Image
Praveen Ramamoorthy
Leader
Indian Institute of Science, Bangalore, India
IEEE SC Image

Activities and Events

IEEE FLEPS 2026
IEEE SC Image
July 12-15, 2026
IEEE SC Image
Atlanta, Georgia, USA

IEEE FLEPS 2026

IEEE FLEPS 2026 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2025
IEEE SC Image
June 22-25, 2025
IEEE SC Image
Singapore

IEEE FLEPS 2025

IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2024
IEEE SC Image
June 30 - July 3, 2024
IEEE SC Image
Tampere, Finland

IEEE FLEPS 2024

IEEE FLEPS 2024 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE FLEPS 2023
IEEE SC Image
July 9-12, 2023
IEEE SC Image
Boston, Massachusetts, USA

IEEE FLEPS 2023

IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems

IEEE FLEPS 2022
IEEE SC Image
July 10-13, 2022
IEEE SC Image
Vienna, Austria

IEEE FLEPS 2022

IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2022.

IEEE FLEPS 2021
IEEE SC Image
June 20-23, 2021
IEEE SC Image
Virtual Format

IEEE FLEPS 2021

On behalf of the IEEE FLEPS Organizing Committee, we thank you for your participation in the IEEE FLEPS 2021 virtual conference. With your help, we were able to bring together a community of about 300 attendees from around the world.

1 2
IEEE J-FLEX

IEEE Journal on Flexible Electronics is approved in 2021. The first issue of this journal has published on January 2022. It is co-sponsored by IEEE Sensors Council ...

lead-co-sponsored