Electronics is simultaneously the world’s greatest enabler and one of its most urgent problems. Various sensors, electronic including AI hardware, surgical implants, smart-grid controllers, and agricultural monitors all depend on electronics — yet the same industry generates a record 62 million tonnes (Mt) of e-waste per year, which is expected to rise to 82 Mt by 2030. With only 22.3% of this e-waste formally recycled, USD 91 billion worth of raw material gets wasted annually. Poor e-waste management externalizes an estimated USD 78 billion in health and environmental costs every year. Upstream, semiconductor fabrication consumes about 800 million m³ of water and emits about 75 Mt CO₂e annually. The ICT sector alone now accounts for 1.7–4% of global GHG emissions, expected to grow rapidly with AI deployment. Moreover, materials marketed as biodegradable (leading to degradable or transient electronics), may still generate harmful degradation by-products that can be managed, but at a cost that makes it economically unviable to do so. Society needs to rethink the way we develop and use electronics is critical now. The goal is not fewer electronics — it is better electronics, for people and planet.
IEEE FLEPS 2026 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
IEEE FLEPS 2025 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
IEEE FLEPS 2024 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems.IEEE International Conference on Flexible and Printable Sensors and Systems
IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2022.
On behalf of the IEEE FLEPS Organizing Committee, we thank you for your participation in the IEEE FLEPS 2021 virtual conference. With your help, we were able to bring together a community of about 300 attendees from around the world.
IEEE Journal on Flexible Electronics is approved in 2021. The first issue of this journal has published on January 2022. It is co-sponsored by IEEE Sensors Council ...
